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Miniaturization Redux – Materials & Processes Section
Miniaturization Redux – Materials & Processes Section
John Skabardonis will guide participants through an interactive session, exploring some of the latest functional integration technologies: The cool electronics we love have traditionally been made possible by electromechanical components which can be bulky, made of dissimilar materials and which have a significant carbon footprint. Functional integration aims to transform these electromechanical components into thinner, […]